VCN: Removing Small Particles From a Variety of Surfaces
Particulate removal from a VCN cleaned 6″-wafers that was known to contain a number of particulates.
The cleaned vias have demonstrated a significantly cleaner surface area than the uncleaned vias. The walls of the cleaned vias are without particle retention. The floors of the cleaned vias have clearly lost loose material and now appear similar to etched structures.
Since vapor bubbles like to nucleate near crevices, defects or particles, the VCN process is ideal for the removal of laser bonded 3D printed parts. With caustic or acidic solutions, the surfaces can become smooth and particle free. The vias above are less than 100μm demonstrating that VCN can reach very tight spaces.